Abstract

The present article introduces a dicing technique for MEMS sensors with ultra-thin membranes (~15μm) assisted by water medium aimed at enhancing the yield. Saw dicing of MEMS piezoresistive differential pressure sensors designed to operate below atmospheric pressure is reported. In MEMS pressure sensors, thin membranes/microstructures, which are typically released, are susceptible to damage during the saw dicing technique, making the process pivotal in MEMS fabrication. This article suggests filling the cavities with micro drops of water to provide mechanical support and alleviate stress and damping effect on the released structures during dicing, consequently enhancing yield.

Keywords:MEMS; Microfabrication; Differential piezoresistive pressure sensor; Saw dicing

Abbreviations:MEMS; Micro Electromechanical Systems; Silicon: Si; SOI: Silicon on Insulator