Abstract

The new microchannel packaging for efficient heat dissipation based on the three-dimensional stacking structure requires the combination of silicon-based interposer plates and microchannel technology. The research in this field should not only focus on the heat dissipation application of microchannels. In the future, it should consider taking into account the transmission of electrical performance, further expand the application, and achieve higher three-dimensional system integration goals. Taking the integration of the new microchannel heat dissipation structure - Through Silicon Via (TSV) as the research object, systematically study the integrated structure design of the microchannel, the new integrated process path, the packaging path of the highly reliable microchannel structure, and establish the corresponding heat dissipation model, and then verify the process architecture from the aspects of simulation and actual measurement. The research on the new packaging of microchannel efficient heat dissipation based on interposer plate technology has practical significance and value for the current miniaturization and reconfigurable development of electronic equipment.

Keywords:Microchannel; Through Silicon Via (TSV); Heat dissipation; Advanced microsystem integrated packaging