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Abstract
Polymer Science: Peer Review Journal
The Non-Isothermal Curing Kinetics of One Epoxy Resin
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Open or CloseChen Peizhong, Fan Zepeng, Chen Yabo and Wang Kejian*
College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, 100029, China
*Corresponding author: Wang Kejian, College of Mechanical and Electrical Engineering, Beijing University of Chemical Technology, Beijing, 100029, China
Submission: October 27, 2021;Published: November 11, 2021
Volume2 Issue3 November, 2021
Abstract
The non-isothermal curing kinetics of one epoxy resin was monitored by Differential Scanning Calorimetry (DSC). Based on the heat release curves at different heating rates, linear regression expression was obtained for the curing start temperature and the peak temperature by extrapolating the heating rate to be zero. The activation energy for curing was calculated by Kissinger and Ozawa models being an average value of 60.44kJ/mol while the reaction order was 0.892 by Ozawa formula. Thus, the n-order reaction kinetics equation was quantitatively determined for choosing reasonable dynamic heat rate and the optimal curing temperature range.
Keywords: Reaction kinetics; Curing; Epoxy resin; DSC
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