Abstract

Anisotropic Conductive Films (ACFs) are the major products used for fine-pitch interconnection technology in electronic packaging because of their low incidence in electrical interconnection issues such as high contact resistance and open/short-circuit failure. ACF are conductive adhesives composed of a suitable binder and electrically Conductive Particles (CP). These CP can be selected from a variety of materials to meet specific applications or requirements. In this Mini Review we describe the different types of conductive particles that can be used in ACF, the advantages and disadvantages of each type, as well as other relevant issues such as particle size, concentration, and capture rate. This work could serve as a guide for any group that is interested in research on ACFs.

Keywords: ACF; ACA; Microparticles; Conductive adhesive; Solder balls; Bonding; Resin